High-Power Dual Platform Laser Cutting Machine 130W 6575 Model
Laser Power | 100W-150W |
Cutting Thickness | 1-15mm (depends on power) |
Engraving Speed | 0-500 mm/min |
Cutting Speed | 0-100 mm/min |
Platform Bottom Plate | Knife holder |
Positioning Accuracy | <0.05mm |
Power Supply | AC220 ±10% 50Hz |
Machine Power | <2550W |
Operating Temperature | 0º- 45º |
Cutting Platform Size | 650mm*750mm*2 |
Cooling Mode | Water-cooling |
Number of Laser Heads | 2 |
Product Solutions: The dual-platform design ensures that production runs smoothly by providing redundancy. If one platform requires maintenance, the other continues operation, enhancing reliability and reducing downtime significantly.
Product Quality: Langsheng Laser ™ machines undergo rigorous testing during assembly to ensure a superior beam profile and maximum power, making them ideal for high-quality cuts and offering a trusted choice for industrial applications.
Product Innovation and R&D: The S-Series is developed with continuous innovation in beam power density, resulting in a cutting beam that offers exceptional resolution for engraving, demonstrating Langsheng Laser's commitment to excellence.
Product Features FAQ:
Q1: What is the cutting speed of the machine?
A1: The machine offers a cutting speed of 0-100 mm/min, suitable for precise works in the advertising and jewelry sectors.
Q2: How does the dual-platform benefit a supplier's production capacity?
A2: It reduces downtime by allowing one platform to operate while the other is under maintenance, enhancing consistent production flow in high-quality manufacturing.
Q3: What power options are available for wholesale orders?
A3: Machines can be customized with laser power ranging from 100W to 150W to meet specific OEM requirements and cutting thickness needs.
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